資源目錄里展示的全都有預(yù)覽可以查看的噢，，下載就有,,請放心下載，原稿可自行編輯修改=【QQ：11970985 可咨詢交流】====================喜歡就充值下載吧。。。資源目錄里展示的全都有，，下載后全都有,,請放心下載，原稿可自行編輯修改=【QQ：197216396 可咨詢交流】==================== Research and Development of Automatic Control System on Material Split Packing and Packaging Integrated Machine Kai Yang1, a, Zhongshen Li1, b and Lei Zhang1, c 1College of Mechanical Engineering and Automation, Huaqiao University, Xiamen, 361021, China , , Keywords: Automatic Control System, Split Packing, Packaging Machine, LPC2478, C/OS-II. Abstract. In order to meet the high speed, high precision, high reliability of the packaging machine, a novel control system is provided. In the hardware, the main circuits consisted of main processor module, memory module, temperature measurement and control module, input signal detection module, material split packing module, output driver module, human-machine interface module, system monitor module, power module and JTAG debug module, etc. In the software, the multi-tasking operating system C/OS-II and the graphical user interface C/GUI were successfully transplanted into LPC2478. Then an experimental platform was established. And many control tasks, including automatic measurement, making bags, loading, transferring, pumping vacuum, sealing and data display, were automatically and continuously executed on the platform. Finally the results show: the machine can package 30 packets (5 g per packet) in a minute; the packaging errors 0.2 g; the packaging qualified rates 93%. In conclusion, the system performance is good. Introduction With peoples living standards improving, higher requirements on material packaging are put forward. Some materials, such as food, medicines, not only require precise split packing, but also need vacuum packaging 1, 2. However, in the traditional mode of split packing and packaging, the work is very heavy, materials are easily contaminated, the packaging quality is not good, and the packaging efficiency is also low 3-5. To realize the integration of the automatic split packing and packaging and to meet the high speed, high precision and high reliability, a novel control system is urgently needed. Therefore, research and development of control system on the split packing and packaging integrated machine is of great significance. And an automatic control system of that machine based on ARM is provided in this paper. The overall design of the control system According to market demands and the split packing and packaging features of small granular materials, packaging processes, containing automatic measurement, making bags, pumping vacuum and sealing, are researched. The control system structure is designed as shown in Fig. 1. When the split packing and packaging machine is running, materials are precisely weighed by material split packing module, and then they are loaded into a ready made inner bag. After that, the bag is put into an outer bag and the whole bag is transferred into a vacuum chamber by manipulators,where air in the bag would be evacuated by air pump. Finally, the whole bag is sealed. During those processes, many solenoid valves are used to control various actuators. And, many sensors are used to detect the weight of the materials and location information.Thus, a complete closed-loop system is formed, and the system stability is improved. Hardware Design of the control system The hardware circuits are composed of main processor module, memory module, temperature measurement and control module, input signal detection module, material split packing module, Applied Mechanics and Materials Vol. 533 (2014) pp 294-297Online available since 2014/Feb/27 at (2014) Trans Tech Publications, Switzerlanddoi:10.4028/ rights reserved. No part of contents of this paper may be reproduced or transmitted in any form or by any means without the written permission of TTP,. (ID: 61.175.244.117, University of California, San Diego, La Jolla, United States of America-18/05/14,08:44:26) output driver module, human machine interface module, system monitor module, power module and JTAG debug module, etc. Some of them are selected to introduce as follows. Main processor module. NXP Semiconductors designed the LPC2478 microcontroller, powered by the ARM7TDMI-S core, to be a highly integrated microcontroller for a wide range of applications that require advanced communications and high quality graphic displays. The LPC2478 can execute both 32-bit ARM and 16-bit Thumb instructions at the maximum 72 MHz system clock rate 6. The LPC2478 inputs signals from photoelectric sensors, magnetic switches, position sensors and infrared sensors. And control signals are output to control electromotors, solenoid valves, LCD, LED and buzzers, etc. Temperature measurement and control module. In this machine, molding inner bag and sealing outer bag are both operated in high temperature. The temperature is measured by K-type thermocouple and controlled by LPC2478. Circuits are shown in Fig. 2. The thermocouple reference function is given as follows: ()()2190-126.96869000niatiiEKta e=+ (1) And its inverse function is: ( )900niiitD E= (2) Where 90t () is the centigrade degree of the thermocouple, and E (mV) is the corresponding electromotive force, 0a, 1a, iK and iDare conversion coefficients 7. The heating resistor temperature is detected by thermocouples mounted thereon and amplified by operational amplifier OP07. Then the signals are converted from analog to digital. In accordance with the temperature control rules in LPC2478, the processed results are output to ULN2003 to control the start of the heating solid state relay YJGX-3FA. TH1+TH1-ADC123_IN10V5C15104R16100R145.1kR115.6kR10100W1200R13100R710MV5R81kR91k6-2+374V-V+U8OP07V5V-5TH1+R122kR15 100kTH1-Thermocouple 1+C1610uC18104D31N414812CN2HEADER 2+C1710uD01D12D23D34D45D56D67GND8RC9D610D511D412D313D214D115D016U14ULN2003YOUT8OUT8YOUT9OUT9V33YOUT8L220Y8Heating resistor 112-3+4SSR4YJGX-3FAR59200OUT8.9OUT8.9 Fig. 1 Control system structure Fig. 2 Temperature measurement and control circuits Material split packing module. The small granular materials are transferred into weighing hoppers with vibrating feeder, where their weight is detected by 3 Kg weighing sensors. Then the signals are converted by A/D converter CS5532. After that, the converted data is transferred to LPC2478 through SPI bus. The weighing module circuits are shown in Fig. 3. As a result of the differences between current weight and set weight and the change rates of them, LPC2478 outputs different frequency to control vibrating feeders. R274.7KV2.5V33C24104JC28104JC26104JL2100uHL3100uHC23104JC27104JC25104JC35223JC36104C37104R284.7KR294.7KR304.7KV33CY34.9152MPS1+PS1-PS2+PS2-12345678910CN4HEADER 10PS1+PS1-PS2+PS2-V2.5C30104JC34104JC32104JL4100uHL5100uHC29104JC33104JC31104JWeighing sensor 1Weighing sensor 2SPI_SSELSPI_SCKSPI_MISOSPI_MOSIM1+M1-M2-M2+V-2.5V-2.5SPI_SSELSPI_SCKSPI_MISOSPI_MOSISPI_SSELSPI_MOSISPI_MISOSPI_SCKAIN1+1AIN1-2AIN2-19AIN2+20C13C24VA+5VA-6A07A18OSC29OSC110SCLK11SDO12SDI13CS14VD+15DGND16VREF-17VREF+18U10CS5532BSZ SPI_SSELOUT25.28SPI_MOSISPI_MISOSPI_SCKsheet4weight.SchDocOUT0.24sheet5Youtput.SchDocsheet6power.SchDocADC123_IN10.11sheet3temperature.SchDocIN10.16IN1.7sheet2Xinput.SchDocOUT25.28SPI_SSELADC123_IN10.11IN10.16OUT0.24IN1.7LCD_R0.4LCD_G0.5LCD_B0.4LCD_CKLCD_FPLCD_ENLCD_LPTP_DITP_CKTP_DOTP_CSTP_IRQnDISPOffSPI_MOSISPI_MISOSPI_SCKsheet1main.SchDocLCD_R0.4LCD_G0.5LCD_B0.4LCD_CKLCD_FPLCD_ENLCD_LPnDISPOffTP_IRQTP_CSTP_CKTP_DITP_DOsheet7LCD.SchDoc Fig. 3 Weighing module circuits Fig. 4 Modules cascade chart ARM human-machine interface module input signal detection module material split packing module temperature measurement and control module and control module output driver module system monitor module memory module power module JTAG debug module Applied Mechanics and Materials Vol. 533295 Module cascade. Most of signals are connected through direct coupling cascade, but signals among external sensors, actuators and module circuits are connected by photoelectric isolation coupling cascade to improve the stability and security of the control system. All module schematics and the overall schematic of the control system are drawn through professional drawing software. And modules cascade is shown in Fig. 4. Software Design of the control system The real-time multi-tasking operating system C/OS-II is introduced to design the control system software which is based on top-down structure model and modular design. At first, the system C/OS-II and the graphical user interface C/GUIare successfully transplanted into LPC2478 and well initialized 8, 9. Then the main program starts to create tasks. The control tasks are mainly made up of automatic measurement, making bags, loading, pumping vacuum, sealing and data display, etc. They are conducted by LCD program, touch screen program, the split packing program, temperature control program, packaging control program, the general input and output program, etc. Some of them are selected to introduce as follows. LCD program. The LPC2478 has its own LCD controller. The TFT true color LCD is used to display packaging information, such as packaging parameter adjustment interface, manual operation interface, material real-time weight, molding inner bag temperature, sealing outer bag temperature and fault message windows. The graphical user interface C/GUI runs in the system C/OS-II, and the human-machine interface is beautiful. The LCD control flow is shown in Fig. 5. Packaging control program. In the light of packaging control requirements, there are a lot of input and output signals to process. Input data, comprising various switching signals and sensor outputs, are used to detect in which packaging process the machine runs. Then corresponding control signals would be generated to open solenoid valve or to start electromotor by LPC2478. Finally materials will be packaged into packets. The packaging process flow is shown in Fig. 6. Fig. 5 LCD control flow chart Fig. 6 Packaging process flow chart Test experiments The hardware and the software were integrated into an automatic control system prototype as shown in Fig. 7(a). An experimental platform of the split packing and packaging integrated machine was established as shown in Fig. 7(b). In the main interface, the control system can display two groups of material real-time weight, molding inner bag temperature, sealing outer bag temperature and the settings of them. Users can adjust the settings through + - buttons. Besides, there are manual operation, packaging parameter adjustment, date and time display, etc. In the test experiments, packaging begin put inner bag into outer bag transfer inner bag outer bag ready? open outer bag pusher ready? chamber ready? rotate vacuum chamber put whole bag into chamber vacuum pumping seal the whole bag end YNYNYNinitialize coordinate, size NLCD begin draw pixel color under a width? calculate bitmap addresses under a height? get memory addresses end YYN296Modern Tendencies in Engineering Sciences packaging weight and amount were measured in the settings of 5 g, 7 g and 15 g respectively in a minute. And each packet was weighed as shown in Fig. 7(c). Then, the material weight of all packets was calculated and recorded. Measurement points and weighing results were shown in Fig. 7(d). The long-term statistical results show: the machine can package 30 packets (5 g per packet) in a minute; the packaging errors 0.2 g; the packaging qualified rates 93%. 0510152025300246810121416Weight (g)Measurement point (a) (b) (c) (d) Fig.7 (a) Circuit board of the automatic control system, (b) experimental platform, (c) weighing packaged materials, (d) measurement point and weighing result chart Conclusions In compliance with the split packing and packaging requirements of small granular materials, an automatic control system is researched and developped. The main conclusions are: a) the hardware and the software of the control system are designed, the real-time multi-tasking operating system C/OS-II and the graphical user interface C/GUI are researched and successfully transplanted into LPC2478. b) an experimental platform of the split packing and packaging integrated machine is established. Many control tasks are automatically and continuously implemented on the platform. c) the inner bag packaging and the outer bag packaging are completed by the machine. And the appearance of the packaged products is consistent. The performance of the whole control system is good. Acknowledgements This work was supported by the Fundamental Research Funds for the Central Universities (JB-ZR1107) and the Jimei Science & Technology Plan Project of Xiamen, China (20137C01). References 1 H.K. Tonshoff, C. Soehner and G. Isensee: Robotics and Computer-Integrated Manufacturing Vol. 13 (1997), p. 1 - 7 2 M.K. Shivhare, D.P. Rao and N. Kaistha: Chemical Engineering and Processing: Process Intensification Vol. 71 (2013), p. 115 - 124 3 J. Boersma and J. Molenaar: Siam Review Vol. 37 (1995), p. 406 - 422 4 R.M. Wu, D. Liu, J.H. Yu and Y.Z. Xiao: Advanced Materials Research Vol. 80-81 (2011), p. 1315 - 1319 5 Z.Y. Peng, H.Z. Li and J.M. Liu: Advanced Materials Research Vol. 320 (2011), p. 487 - 491 6 Information on http:/ 7 T.Y. Wang, C.Q. Hua: Microcomputer Information Vol. 19 (2003), p. 62 63 (In Chinese) 8 J.J. Labrosse: MicroC /OS - The Real-Time kernel, Second Edition (CMP Books, USA 2002). 9 B.B. Guan, L.G Tian, Z.Z. Cheng, Z.L. Chen and X.L. Wu: Applied Mechanics and Materials Vol. 303 - 306 (2013), p. 1485 1488 Applied Mechanics and Materials Vol. 533297Modern Tendencies in Engineering Sciences 10.4028/ Research and Development of Automatic Control System on Material Split Packing and PackagingIntegrated Machine 10.4028/